產品介紹
德國 ASYS 提供的軟體
解決方案，能讓您的生 產管理模式煥然一新。
PULSE PRO 軟體，包含七類軟體模組，它能説明您控制車間的自動化物料流，確保您實現每台機器的物料供應動態化，即時化，此外所有生產資料流程，隨時供您過目。您可以通過控制台輕鬆操作PULSE PRO軟體，完全採用傻瓜式操作。 如此高品質，高效率的操作，是基於操作員任務派發模式。無論您面對多麼複雜的工廠情況，PULSE PRO都能説明您快速又輕鬆地發現問題並解決問題。
Product Overview
Terminal (Pin) tape-reel incoming material method, including weld-type terminals & solderless eyelet pin terminals.
M/C Model: AI-04H
Max. 4 Insertion Head Tools
Max. PCB Size: 350 × 350 mm
M/C Model: AI-03
Max. 3 Insertion Head Tools
Max. PCB Size: 300 × 220 mm
M/C Model: AI-03L
Max. 3 Insertion Head Tools
Max. PCB Size: 350 × 350 mm
Product Overview
Includes automatic fuse/relay insertion process.
2011 – 1st Generation Automatic Assembly Line.
2011 – Fuse & Relay Insertion Machine (MC).
2020 – 2nd Generation New-Type Automatic Assembly Line.
Flexible design and modularized stations / easy quick product changeover / insertion head tool moving type / RFID application management & MES integration.
Product Overview
Loose Pin Terminal Incoming Material Method
M/C Model. AI-03BL
2 Insertion Head Tools(Dual-Core Type)
Max. PCB Size: 350*350mm
M/C Model. AI-03J
1 Insertion Head Tool
Max. PCB Size: 300*220mm
Product Overview
Turbo pump capacity: Max 1 × 10⁻⁶ Torr
Vacuum profile display (programmable vacuum values)
Sensing profile display for each process step
Flexible use of Mode 20 Step according to different processes and requirements
Adjustable operation time
Sealing bar with easy maintenance
Manual chamber door open/close
High-pressure vacuum chamber professional welding
Digital display of all equipment operating conditions
Drawer loading error-proof function
Product Overview
Turbo pump capacity: up to 1 × 10 Torr
Leak test structure for enhanced reliability
Vacuum curve display with adjustable vacuum values
Automatic chamber door opening/closing
Sensor profile display for each inspection step
High-power vacuum welding type design
Chamber pressure display down to 0.000001
Adjustable working time settings
Display of all equipment operating conditions
Easy-to-maintain sealing rod
Stability check for products across multiple floors
Product Overview
Improve press accuracy using precision servo motors.
Fine-tuning can be performed via the feed controller in the product supply section.
Prevent additional defect rates through first and second inspection processes.
Add a blower system to remove foreign materials.
Utilize silicon substrates (0.5T).
Product Overview
Product Series: FF Series
Application Industries: Automotive manufacturing, Microelectronics, Aerospace, Research & Development (R&D), Casting, Additive manufacturing
Defect Size: <1 mm defects, >1 mm defects
Sample Size: Small, Medium, Large
Operating Modes: 3D, 2D/3D
Product Overview
Product Series: UX Series
Application Industries: Automotive manufacturing, Aerospace, Research & Development (R&D), Weld inspection, Casting, Additive manufacturing
Defect Size: <1 mm defects, >1 mm defects
Sample Size: Small, Medium, Large
Operating Modes: 2D, 3D, 2D/3D
Product Overview
Product Series: CC Series
Application Industries: Automotive manufacturing, Microelectronics, Aerospace, Research & Development, Semiconductors
Defect Size: <1 µm defects, <50 µm defects, <1 mm defects, >1 mm defects
Sample Size: Small, Medium
Operating Modes: 2D, 3D,
Product Overview
A world-class SMT reflow oven designed for high-volume production, delivering superior throughput.
Pursues higher productivity with improved temperature uniformity.
Achieves lower nitrogen and power consumption, saving up to 40%.
Provides inline operation and maintenance without consumables.
Offers a vacuum solution to eliminate voids.
Fully Industry 4.0 compatible.
Includes integrated CPK software free of charge.
Product Overview
A world-class SMT reflow oven designed for ultra-wide boards and dual-lane production, providing customers with a more economical solution.
The new heating and cooling technology minimizes nitrogen and power consumption, achieving up to 40% savings in nitrogen and electricity.
Therefore, the MK5 series not only delivers outstanding performance but also represents the most cost-effective reflow oven series in the industry.
Product Overview
The Spectrum™ II dispensing system, with world-class accuracy and quality, is designed for mobile electronics, semiconductors, MEMS, and PCB assembly dispensing applications.
Product Overview
The Helios™ SD-960 series is specifically designed for medium- and high-volume dispensing applications, supporting a wide range of single-component and two-component processes, including high-wear thermal interface materials (TIMs), potting, sealing, leak prevention, structural adhesives, silicones, epoxies, and greases.
Product Overview
Nordson ASYMTEK’s Quantum® systems, available in both inline and offline configurations, continuously enhance quality, productivity, and throughput to meet the demanding requirements of high-standard dispensing applications.
Product Overview
The Forte™ series delivers outstanding dispensing efficiency and precision for high-volume printed circuit boards (PCBs), flexible circuits, MEMS, and electromechanical assembly processes.
This enhanced system integrates next-generation technology with proven long-term performance, achieving up to 50% higher productivity compared to the best-selling Spectrum® II.
Product Overview
Next-generation dispensing functionality for precision packaging and assembly.
Utilizing the ASYMTEK Vantage® series, IntelliJet® jetting system, and Canvas® software, delivering unmatched dispensing performance for advanced applications.
Product Overview
The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as prototyping purposes.
But also a large variety of other flexible and rigid substrates up to a size of 180 x 160 mm can be processed on the M2H. The substrates can be placed on to different types of print nests mounted on the horizontally moving table. For a convenient substrate alignment, the printer can optionally be equipped with the manual optical positioning system MOPS. The substrate is then manually aligned using high resolution cameras for reliable recognition of fiducials or other layout features.
The easy to use Microsoft Windows based software allows for storage of all process relevant data. This process relevant data can easily be recalled again for quickest product changeovers.
Different squeegee types and materials can be selected according to the printing requirements. For printing of Green Tapes or other kind of flexible foils the so called “porous stone” can be used as print nest.
Product Overview
The 3D screen printing system “XH3D“, a machine type out of EKRA´s unique 3D Printer platform. By using stencil- or screen technology, it generates complex 3D structures on an base plate.
According to the actual printed layer height, the machine adjusts automatically the snap off distance.
Optionally the machine communicates with the patented screen exchange unit. The capacity of the unit allows to store up to 10 screens.
The base plate for the 3D compenent print, can be fixed by vacuum, direct at the movable print table. An optional drying system can be placed beside the machine to cure the actual layer.
Product Overview
The XH2 screen and stencil print system has been specially developed for printing hybrids, with a particular emphasis on combining highest precision with maximum flexibility. This inline print system utilizes the patented EVA™ –EKRA Vision Alignment System. The EVA™system is an optical positioning system with a free-moving camera. Both the camera axis and the screen adjustment assembly have integrated high precision measuring systems which together ensure a repeatability of ± 12,5µm@ 6 Sigma.
To ensure the highest possible flexibility, different methods of substrate position detection can be selected for the camera system. For substrates with polished surfaces, an edge detection system is selected and if structures such as fiducials, holes, or print images are to be used for positioning, then fiducial recognition can be selected. This versatile camera system even has the capability to position the substrate using synthetic fiducials, a method which minimizes tolerances created by previous process steps.
A particular advantage of this print system is that no mechanical centering is required, allowing stress-free processing of the fragile substrates.
Thanks to the closed-loop adjustment of both print heads, the programmed squeegee pressure remains constant throughout the entire printing path, independent of the substrate properties and the print parameters. Depending on the required print-process, a number different squeegee profiles can be selected.
Fastest cycle times and High Precision are the key features of the fully automated XH1 screen printer. The XH1 is the high-end solution for printing of ceramic substrates.
Its design is unique on the market and is based on excellent experience over many decades in the hybrid market.
The overall throughput of the system is in the range of 3,2 s including printing and is not only the result of a short handling time but includes as well the fully automated screen alignment. The extremely easy product changeover can be reduced to about 1 min and can be performed as well by low level instructed operators.
The alignment of the substrate is performed via the EKRA patented edge recognition. Therefore 3 cameras (alternatively 5) are mounted underneath the print nest and lookup to the substrate edges through sapphire glass modules. The light sources are as well incorporated in the sapphire glass modules. The coordinates of the recognized substrate edges are stored and according to this coordinates the screen is adjusted with a alignment repeatability of ± 12,5µm @ 6 Sigma.
Product Overview
The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules, a loading unit and a printing system. The loading unit in turn consists of three components: a magazine unloading system, a robot unit and a pre-align station. The magazine unloading system is equipped with two magazine positions from where the wafers are fed to the machine. The 3-axis robot unit with vacuum end effector ensures a stress-free wafer transport. Using a flexible pick-up, different end effectors can be used even for very thin or curved wafers.
After taking a wafer from the magazine, it is placed re-positioned in the built-in pre-align station via flat or notch recognition for subsequent printing. The wafer is then place by the wafer robot into a vacuum printing nest and then lowered and fixed. After transporting the printing table into the printer, the fiducials are detected by the moving camera and the screen or stencil is fine-adjusted.
Printed wafers can now be transported back to a magazine or removed individually with a drawer system. Optionally, processed wafers can also be fed automatically to other machines by a transport system.
Subsequent process steps, such as heat treatment, can optionally be integrated in or on the loading cell. OCR or camera reading systems are available for identification of any text on the wafers or 1D/2D codes. Communication of the cell through the SECS-GEM protocol or connection to custom MES systems is possible as options.
Product Overview
Product Overview
Suitable for substrate sizes up to 1500 mm.
Printing direction follows the substrate transfer direction.
Closed-loop screen printing squeegee unit, ensuring maximum layer thickness stability.
Supports substrate weights up to 20 kg.
Product Overview
Carrier for multi-panel substrates, with temperature stability up to 800 °C, preventing re-alignment between drying and sintering.
Pre-print substrate alignment (position correction) for each panel.
Height tolerance compensation across all substrates, ensuring uniform gap distance (screen-to-substrate surface).
In addition to printing, we provide extensive full-line solution expertise, offering high levels of automation and diverse process options.
Product Overview
Special transfer systems (paper transfer, vacuum transfer) for handling ultra-thin substrates.
Special screen printing platforms: desktop and in-line concepts enabling borderless printing.
Optical alignment without mechanical stops, preventing substrate breakage.
AutoHead squeegee system: fully automated squeegee head for precise medium application via screen printing.
Product Overview
Solder paste, Silver paste (conductive and non-conductive), Flux, Metal paste for 3D, screen printing, Thermal paste, Silver conductive adhesive, Polymer paste (UV-curable), Glass paste, Gold paste, Copper paste, Silicon paste, Conductive polymers (e.g., PEDOT:PSS)
Product Overview
Wafer, Lead frame, DBC/DCB/IGBT, Ceramic substrate, Metal tube, LTCC/HTCC, Glass, Printed Circuit Board (PCB), Solar cell, Metal or polymer foil (e.g., PP/PET), Forged metal parts, Bipolar plates and membranes.
Product Overview
Available in two models: X5 Professional and X5 Professional Dual.
Achieves unmatched performance with minimal energy consumption.
All printing-related motion systems are servo-controlled.
Delivers the highest repeatability and throughput, validated by 01005 technology.
Features unique product engineering and design.
Includes the innovative, award-winning SIMPLEX software (NPI Award, 2011).
Low self-heating, minimizing environmental thermal load.
Offers unlimited flexibility, with multiple options to customize or upgrade your system.
Product Overview
Silicon / Surface Mount Technology (SMT) for high-precision and high-speed assembly.
High accuracy: (±10 µm, < 3 µm placement repeatability).
Dual-beam or single-beam, multi-axis needle placement heads.
Supports a full range of die and component types and sizes.
Versatile substrate handling.
Various feeding platforms.
Low maintenance, long-term accuracy.
Robust vision recognition of pins or logic pads.
Stacking support (package-on-package).
Low placement force.
Product Overview
Wide chip placement size range, capable of handling ultra-thin dies.
FuzionSC can process panels up to 635 mm × 610 mm.
Equipped with 14 high-precision servo-driven placement heads (X, Y, Z axes with sub-micron movement).
Features a servo-driven die ejector system with sub-micron accuracy (X, Y, Z axes).
Provides 100% pre-pick component vision coverage and wafer alignment.
Wafer-to-placement transfer completed in a single step.
Wafer expansion and storage performed simultaneously.
Dual-wafer placement tables, achieving placement speed up to 16K cph (components per hour).
Supports placement of up to 52 unique wafer types in a single run; sizes include 100 mm, 150 mm, 200 mm, and 300 mm.
Product Overview
High-speed, multi-die advanced packaging.
The combination of FuzionSC™ and HSWF™ enhances productivity in advanced packaging assembly, enabling precise placement of both passive and active components on a single platform.
This solution supports virtually any feeding option, meeting the requirements of high-volume production.
